Iec ts 626474 process management for avionics aerospace and defense electronic systems containing leadfree solder part 4. Micron bga manufacturers user guide micron technology, inc. Place bga on top of polyimide solder ball stencil carrier. Should i buy a bga rework machine for my repair shop. One of the key aspects in electronics manufacturing is to ensure that the soldering specifications defined by the. The minioven frame, mask and holder are used in the reballing process. Bga reballing isi has an advanced, qualified process for removing and reballing solder spheres that is compatible to the assembly process criteria for any bga package. Rework, modification and repair of electronic assemblies.
For more information on reballing, contact aci technologies by calling 610. In the case of ball grid array bga components this is done by a reballing process. This instructable will use the solder preform process to teach you how to reball a plastic bga in about 10 minutes or less. Reflow source reflow oven, hot air system, ir system2. Bgas can develop problems due to unreliable solder joints which have. Optimum fusing of the components soldering surfaces with the pwb is achieved when. Array reballing is typically needed when a bga has been misplaced on the placement line, when solder paste pressure has not been sufficient, or when the pads of the circuit board are oxidized and there is no contact through the solder balls anymore. Lead free to snpb bga reballing process and reliability. Why bga reballing and why it is important slideshare. Apply tacky flux to the flat bga component pads using a brush. The third option is to perform bga reballing, which especially takes on increased significance as original equipment manufacturers oem continue to populate pcbs with a large number of leadfree bga components 5. Find our for yourself which bga reballing process produces the highest yield at the lowest possible cost. Most questions concerning bga reballing process reliability focus on two specific. A brief description of the reballing process as well as some of the inspection tools is also discussed.
Our experience would indicate there is no need to change the process with a change in ball size or ball count. It is the thermal cycling that causes the following in leadfree solder over time electronics. Allow bga to cool for 30 60 seconds and remove polyimide solder ball stencil. Lead free components require a more stringent process control, and without tight process control, the bga solder joint can be unreliable.
Polyimide stencil technique reballing technique at. Process is totally repeatable, and contains no risk in terms of component damage through thermal stressthis has involved a huge investment in process capability, but it has allowed retronix to become the worlds no. Surface mount design, materials and, process recommendations. Ipc 3000 lakeside drive, suite 309s bannockburn, illinois 600151249 tel 847 615. Tinlead sn63pb37 eutectic, leadfree, and specialty alloys any ball size and ball pitch including chip scale packages processes are tailored to each part. Bga lga rework processes the following describes the general bga rework process covering the development and criteria for establishing profiles for bga removal and replacement. How to gold recycle sun computer server mainboard from ic chip chipset bga ic chips recycling. Jaywn, reballing is usually performed to replace a bga ic, not a device. These procedures are new additions to the ipc7711b7721b. Bga rework process implementation home training bga rework process implementation this high tech course is designed to help you set up your own bga rework department in house and for those companies that are already doing bga rework but are having difficulty to achieve a high yield. Reballing is a mature process with no special skills required. Tinlead sn63pb37 eutectic, lead free, and specialty alloys any ball size and ball pitch including chip scale packages processes are tailored to each part. Isi has an advanced, qualified process for removing and reballing solder spheres that is compatible to the assembly process criteria for any bga package. A tc should be used in a joint at one corner of the component, and in a joint at the center of the part, or as near to the center of the part as possible.
The reballing process consists of removing the leadfree solder balls from a bga component and replacing them with new snpb ones. This video demonstrates a safe and easy reballing process on a fineplacer hot gas rework system in order to repair a bga component. The best performing reballing fluxes now available on the market. This article describes the required bga reballing process, specifically the preform method.
Retronixs 8 step bga recovery the only safe ic recovery process on the market. General process bga handling stencilquik method ezreball method high volume method dry packaging ceramic package reballing challenges optional services. Peter vigneau general manager circuit technology center, inc. So, the things what youve need is a bga kit and a bga rework machine which all are available in the market and you can also find it easily on the internet too, and thats the compulsory tools what youve always needs while performing a bga circuit reballing. Chemicals used in reballing process can cause skin irritation. The frame is inserted into the holder, the component added, flux applied and the mask aligned. It has become somewhat more accepted to reflow devices like ps3 xbox etc. Introduction reflow process overview selection of solder paste. Rework or re work is the term for the refinishing operation or repair of an electronic printed circuit board pcb assembly, usually involving desoldering and resoldering of surfacemounted electronic components smd.
If bga reballing services are required then contact. When we consider reworking an array package such as a bga or csp, it is recognised that process control is of paramount importance to achieve a successful. Place bga and carrier onto the reflow station or into a reflow oven and reflow using established profile. For more information, please contact the helpline at. The apr reballing kit is used to place replacement solder balls onto bga components. Rework, modification and repair of electronic assemblies developed by the repairability subcommittee 734 of the product assurance committee 730 of ipc users of this publication are encouraged to participate in the development of future revisions. Alignment is simple with the edges of the preform being squared up with the sides of the package thereby. Bga reballing procedure 7711 polyimide solder ball stencil. Impact of process control in pbfree to snpb reballing. Component manufacturers specify no more than 3 reflow cycles for their components, so this laser process enables our customers to meet this requirement. Flux should be evenly applied across the entire bga pad. Bga reballing services micross ball attach deballing.
The bga rework process can be methodically worked out by following these process guidelines though difference in printed circuit boards, devices populated on those boards. Stencilquik reballing this best developed reballing technique for area array devices is the designed for speed and fast turnaround of small to medium volume quantities. Micross components has developed a proven process for reballing ball grid array bga components to restore them to their original specifications or to bring them up to standards for use in hirel applications. Table of contents page inventory of kit items 1 introduction 4 before you begin 5 bga deballing process 7 bga reballing process 11 cleaning fixtures 16 bake and dry packaging 18 flexible fixture setup optional 20 reflow temperature profile 22 frequently asked questions 25 glossary 26 safety precautions 29 warranty 31 sm4064 rev a. Ic repair, bga repair, bga reballing, ic test are all part of this process. Deball the device apply a water soluble paste flux using a syringe and apply a ball of the device with a gloved finger. Bgas can develop problems due to unreliable solder joints which have become more common with the advent of lead free solder balls. The materials required for such an operation are outlined below. Also included is a contactless removal of residual solder from.
At bencor, we have the capability and expertise to accommodate your leading edge. Primary phases of the reflow process are 1 flux activation, 2 melting of the solder paste, 3 wetting the surfaces to be joined, and 4 solidifying the solder into a strong metallurgical bond. Process control and reliability of reworked bga solder joint adrian hirceaga ishrat hasan creation technologies mississauga, on, canada adrian. Oxidation prevents solder alloys from wetting properly during the soldering process, enables voiding and. This involves removing the current solder balls off the pads and reflowing new solder balls on the pads. The need for reballing is explained as well as the diifferent methods of reballing as a function of the number of devicss to be reballed and the type of bga package being reballed. When properly employed, the practice of reballing can save money and time for a manufacturer and therefore a thorough understanding of the benefits of this process can be a valuable investment of time and resources. The bga reballing process is explained in this slide set. Most of the time a reflow is based on generally known failures. As the electronics industry continues to transition to a lead free environment, component suppliers are phasing out the standard snpb alloy process for bga balls and termination surface finishes.
High reliability products that require comprehensive product qualification may not readily transition to a mixed system solution lead free components and tinlead solder joints. Any ball size and ball pitch including chip scale packages. Process gas can be used to minimize unwanted oxidation. Dry with a clean wipe or blow off using an air gun. Develop process develop profile part removal site preparation placement reflow inspection. Reliability assessment on the reballing of pbga semantic scholar. Tinlead sn63pb37 eutectic, lead free, and specialty alloys. Years of experience, the correct equipment and a robust bga rework process all help to insure high expected yields. Device needs reballing ball removal by dissolution in molten solder ball removal by dissolution in molten solder followed by hot air knife ball removal by melting and wicking manual. Effect of bga reballing and its influence on ball shear. Bga rework process implementation precision pcb services. Place bga on top of polyimide solder ball stencil carrier solder balls up and white tape down see figure 3. As technology continues to advance, more products are being designed with bga, fpga and qfn devices, which all have special rework requirements. Isi has an advanced, qualified process for removing and reballing solder spheres that is compatible to the assembly process.
Therefore, a bga reballing process was introduced as a fall back solution for a scenario in which leadfree components had to be populated on pcb assemblies. The simple nature of the ezreball reballing process allows even the beginning repair technician to reliably and quickly replace balls on a bga package. Micross has developed a proven process for deballingreballing ball grid array bga components to restore them to their original specifications or to bring them up to standards for use in hirel applications. The process is completed by placing the prepared bare bga component onto the solder balls on the board and reflowing using the same profile used for standard rework process. It is an easy, fast, and lowcost technique for bga reballing in volumes ranging from a few to several thousand. Most advanced laser reballing process retronix have a top of the line process that sets a benchmark for advanced laser reballing service. Remove the solder ball using the appropriate blade tip or temperature setting based on the solder ball alloy. Home catalog blog about us home products products browse by all actuator bga balls bga nozzle bga ovens bga pad repair bga reballing bga reballing services bga rework bga rework machine bga rework nozzle bga rework services bga rework station bga rework stations bga rework system bga rework training crcuit board assembly drying ovens. How to properly prepare the bga to reduce heat and moisture damage. Gently brush the surface until all evidence of flux and debris have been removed. Iects 626474 bga reballing top level table of contents forward introduction 1. Typically, this process is done with replacing solder balls of the same alloy, in order to maintain the same properties the component had before.
Specific control parameters are clearly defined for. Developed by the repairability subcommittee 734 of the product assurance. It uses a vacuum pump and fixture to affix a bga component while solder balls are sprinkled and brushed into place using a customized reball screen sold separately. Save up to 9095% of the bga cost reballing cost will be 510% of the new bga cost reduce material inventory that can save millions of dollars a year. Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using appropriate equipment are.
973 855 769 1443 1065 1070 1000 1423 1540 301 459 1529 519 575 70 816 35 857 353 851 907 453 261 1333 1516 460 760 155 286 758 1520 1147 1271 1138 840 453 1045 1262 1226 1264